2004 May 05 2
Philips Semiconductors Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D
audio amplifier
TDA8928J
CONTENTS
1 FEATURES
2 APPLICATIONS
3 GENERAL DESCRIPTION
4 QUICK REFERENCE DATA
5 ORDERING INFORMATION
6 BLOCK DIAGRAM
7 PINNING
8 FUNCTIONAL DESCRIPTION
8.1 Power stage
8.2 Protection
8.2.1 Maximum temperature
8.2.2 Maximum current
9 LIMITING VALUES
10 THERMAL CHARACTERISTICS
11 QUALITY SPECIFICATION
12 DC CHARACTERISTICS
13 AC CHARACTERISTICS
14 SWITCHING CHARACTERISTICS
15 TEST AND APPLICATION INFORMATION
15.1 SE application
15.2 Package ground connection
15.3 Output power
15.4 Reference design
15.4.1 Printed-circuit board
15.4.2 Bill of materials
15.5 Curves measured in reference design
16 PACKAGE OUTLINE
17 SOLDERING
17.1 Introduction to soldering through-hole mount
packages
17.2 Soldering by dipping or by solder wave
17.3 Manual soldering
17.4 Suitability of through-hole mount IC packages
for dipping and wave soldering methods
18 DATA SHEET STATUS
19 DEFINITIONS
20 DISCLAIMERS